Product Description & Reviews
Specification: Dimension: 20mm x 25m (Width x Length) Glass fiber thickness: 0.15mm Thermal Conductivity: 1.5 W / m-k Breakdown Voltage: 5KVAC Thermal resistance: 0.3 ° C in2 / w Initial Adhesion: 1.5kg / inch 180 ° Adhesion power:> 18 N / 25mm Applicable temperature range: -30 ~ + 150 ° C Features: Thermal conductivity and high stability, its life than the general heat double-sided stickers long, normal temperature (30 ~ + 150 ° C) can work for a minimum of 5 years. Notes For Attention: 1.When using thermal conductor double-sided tape, keep the adhesive surface clean and dry 2.After tearing off the heat-conductive double-sided tape to peel the paper, double-sided thermal tape is evenly pressed with your fingers (just a little strength). 3.The viscosity of the heat-conductive double-sided adhesive tape has initial viscosity and aging viscosity, and at room temperature, it takes 72 hours to achieve the maximum adhesive strength, That is, at the beginning of the sticky adhesive that is the initial viscosity to 40% of its maximum viscosity, persistent stickiness is stable over time. 4. of the paste process, the appropriate heating (60 ~ 70 ° C), the post to the effective increase in the area of adhesive, and as soon as possible to achieve maximum adhesion, In the lower temperature of the winter, it's little tips that heating to increase the viscosity of the heat-conductive double-sided tape when using the thermal conductive tape. Package included: 1 Roll Thermal Conductive Double-sided Tape
Features & Highlights
- thermal conductivity double-sided adhesive With high thermal conductivity and insulation properties and compression, adhesion,Can fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,Has strong adhesive strength,and thermal resistance is small,effectively replace the grease and mechanical fixation,A large number of applications in the bonding heat sink to the microprocessor and other power consumption of the semiconductor
- Widely applied: high power LED,High power power supply, automotive electronic heating module, motor controller, communication equipment, power semiconductor, MOS tube, power tube, IGBT chip, high voltage, high temperature, high power welder, display, computer, Video Card RAM, DDR Memory Modules, SSD drives,solar , New energy heating power devices
- Features: With the features of high thermal conductivity, insulation, strong stickiness, softness, compression, thermal double conductive tape is great helper to solve heat dissipation for many electronics products
- Easy to use: Just stick on surface of any object and tear the blue release paper, which can be tightly and firmly conglutinate on the heat source devices and heat sink to speed the heat dissipation.
- Double-sided thermal adhesive tape at low cost solve the problem of both good heat dissipation and strong stickness, while improving the work efficiency. Which make the heat sink and IC chip bonding, make high power LED and heat aluminum bonding, replaced with a screw fixed, to achieve the most effective thermal dissipation.
|Item Weight:||0.44 pounds|
|Item Size:||4.72 x 0.98 x 0.98 inches|
|Package Weight:||0.4 pounds|
|Package Size:||4.9 x 1.1 x 1.1 inches|
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